Modules I/O cho bộ lập trình nhúng PAC ICP DAS
Remote I/O Modules support a wide range of of field signals including including current, voltage, thermistor, thermocouple, RTD, and strain gauge with many protocols and interfaces.
Modules I/O cho bộ lập trình nhúng PAC ICP DAS
Remote I/O Modules support a wide range of of field signals including including current, voltage, thermistor, thermocouple, RTD, and strain gauge with many protocols and interfaces.
Showing 1–16 of 344 results
X600 4 MB Flash
16-ch Isolated DO (3.5 ~ 50VDC) Expansion Board
16-ch Isolated DO (10 ~ 40VDC) Expansion Board
4-ch AO, 4-ch DI and 4-ch Power Relay Expansion Board
4-ch Thermocouple Input, 4-ch DI and 4-ch Power Relay Expansion Board
4-ch AI, 2-ch AO, 4-ch DI and 4-ch DO Expansion Board
4-ch AI, 4-ch DI and 4-ch Power Relay Expansion Board
5-ch Isolated DI and 6-ch Relay Expansion Board
8-ch Isolated PWM Output Expansion Board
8-ch Isolated Dl and 8-ch Isolated DO Expansion Board
8-ch Isolated AI and 8-ch Isolated Universal Digital I/O Expansion Board
8-ch Isolated DI and 8-ch Isolated DO Expansion Board
1-port Non-Isolated RS-422/485, 5-ch Isolated DI and 5-ch Isolated DO Expansion Board
16-ch Isolated DO Expansion Board
XV110 CR 16-channel Isolated Dry and Wet Contact Digital Input Module With 16-bit Counters (RoHS)
16-ch Isolated DI Expansion Board
Modules I/O cho bộ lập trình nhúng PAC ICP DAS